CTS物联网解决方案产品

IoT Solutions & Product Frequency Reference Guide

The Internet of Things [IoT] is the new wireless touchstone connecting live information, control mediums and hubs to wireless devices such as phones, tablets and computers. These applications are widely used in Smart Homes, Smart Cities, Smart Factories, Smart Healthcare, Smart Agriculture and Smart Energy. Communication protocols and transmission frequencies are guided by standards such as IPv6, UDP, QUIC, Aeron and uIP. As a result, next generation MCUs, SoCs or FPGAs created to meet new communication requirements have challenged chipset designers to develop architectures that provide improved fast communication along with low noise performance, but also at low power consumption. Utilizing low power elements helps continuous operation over long periods of time, but also increase challenges like reductions in oscillator gain margin and signal to noise ratios.

CTS Crystal Currently there are billions of connected IoT devices. An exponential increase of connected devices is expected over the next decade, as 5G infrastructures will be readily available along with more affordable consumer devices. The seemingly limitless connections promised by 5G will continue to burden infrastructures and push the boundaries of chipset performance, requiring the timing block and associated frequency reference to provide very reliable low power operation. 

物联网解决方案和产品频率参考指南

物联网[物联网]是将实时信息、控制媒体和集线器连接到手机、平板电脑和电脑等无线设备的新的无线试金石。这些应用程序被广泛应用于智能家居、智能城市、智能工厂、智能医疗保健、智能农业和智能能源等领域。通信协议和传输频率以IPv6、UDP、QUIC、Aeron和uIP等标准为指导。因此，为满足新的通信需求而创建的下一代mcu、soc或fpga已经向芯片组设计者提出了挑战，要求他们能够开发出能够提供改进的快速通信、低噪声性能和低功耗的架构。利用低功率元件有助于长时间连续运行，但也会增加降低振荡器增益边际和信噪比等挑战。

目前，已有数十亿个已联网的物联网设备。随着5G基础设施将与更实惠的消费设备一起随时可用，预计联网设备在未来十年将呈指数级增长。5G所承诺的看似无限的连接将继续加重基础设施的负担，并推动芯片组性能的边界，需要定时块和相关的频率参考来提供非常可靠的低功率操作。

物联网增强晶体，CTS增强晶体：

新的CTS石英晶振型号[412W、416W、402W、425W、403W]为消费者和工业企业的低功耗无线协议[IIoT]。

关键4xxW晶体参数

低电镀电容[C0]，<3.0pF
低ESR范围[R1]
小负载电容选项[CL]
温度范围-40°C至+125°C
稳定性选项-±10ppm至±150ppm
基本水晶设计
小型陶瓷表面安装封装
磁带和卷轴包装

低ESR调谐叉形晶体：

CTS低ESR系列调谐叉晶体，提供低至50k欧姆的电阻，允许便携式或手持电子设备使用低功率FPGAs和微控制器[mcu]，以保持电池长时间运行寿命。
Key TFE晶体参数
低电镀电容[C0]，1.0pF典型值
低ESR值[R1]<50k欧姆
小负载电容选项[CL]
温度范围-40°C至+85°C
小型陶瓷表面安装封装贴片晶振
磁带和卷轴包装

对于需要更精确的32.768kHz参考的应用，GPS功能，CTS RTC解决方案是TT32 TCXO。
关键TT32 TCXO参数
低电流消耗，<2µA
紧密频率稳定性，±5.0ppm 32.768K
温度范围-40°C至+85°C
小型陶瓷表面安装封装
磁带和卷轴包装

CTS产品频率参考